Freedom CAD PCB Fabrication

 
CAPABILITY SUMMARY D = Development D  
  LP = Limited Production LP  
  MP = Mass Production MP  
  FEATURE 2007 2008
Layer Count 2-40 Layers MP MP
  40+ LP MP
Board Thickness  .005" Min D LP
   .300"  Max MP MP
   >.300"  Max LP MP
Material Type FR4 Tg 140 MP MP
  FR4 Tg 150 MP MP
  FR4 Tg 180 MP MP
  Getek MP MP
  Rogers MP MP
  BT MP MP
  Polyimide MP MP
  Duroid MP MP
  Polyclad 370HR MP MP
  Isola IS 410 MP MP
  TUC MP MP
  Halogen Free MP MP
Line Width & Space .0035" / .0035" MP MP
  .003"/.003" LP MP
  < .003"/.003" D LP
Surface Finishes HASL MP MP
  Tin Nickel MP MP
  Gold Electroplate MP MP
  White Tin MP MP
  ENIG MP MP
  Immersion Silver MP MP
  Entek MP MP
Mechanical Drill .008" MP MP
Laser Drill .004" LP MP
Aspect Ratio 15 to 1 MP MP
  >15 to 1 LP MP
HDI 1+n+1 MP MP
  2+n+2 LP MP

 
 
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