Freedom CAD’s Scott McCurdy, President of the Orange County chapter of the IPC Designers Council, has announced the agenda for the March Meeting. The meeting is set for Wednesday, March 17th, from 11:30 am – 1:30 pm at Broadcom Corp’s. Irvine facility.
Charles Pfeil, Engineering Director at Mentor will be presenting “Effective Design Methods for Very Large BGAs”.
Mr. Pfeil has been in the PCB design industry for 40+ years and literally “wrote the book” on this subject. There are many benefits to using the BGA package; however its greatest asset – the ability to provide an extremely dense array of thousands of pins – also turns out to be a tremendous problem for PCB designers. The BGA density and pin count continues to increase; yet, our ability to effectively design with these devices has not kept pace.
Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process. These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices. Mr. Pheil will explore the impact of dense BGAs with high pin-count on PCB design and provides solutions for inherent design challenges.
In addition, Vern Wnek, of Broadcom’s Chip Planning and Packaging Group will be presenting “Let your PCB Layout Team help you be SUCCESSFUL”
Mr. Wnek is a CID and a PCB Manager and the Central Library Manager for Broadcom Corporation in Irvine, CA. He has 30 years experience in the industry with PCB Layout Designs and EDA tools for DFM, DFA, and DFT requirements and is a multiple Co-Patent holder for Routing Optimization for Ball Grid Array Packaging for PCB Design. He will discuss how to create a successful team process and approach for Chip IO Planning and PCB Layout Optimization to help save your customer time and money.