SPECIAL ANNOUNCEMENT – IPC Designers Council “Lunch ‘n Learn” event on 6/28 in Irvine, CA

Date:         Thursday June 28th, 2018
Time:        11:30 am – 1:30 pm
Where:      Harvard Athletic Park multi-purpose room – Irvine

1st Topic: Addressing the challenges of multi board design – Taking the “big picture” approach to system design.

Speaker: Chris Carlson, CID, Senior Field Applications Engineer at Altium

Topic: As technology becomes more complex and miniaturized, the need for more complex multi board systems arise. Clear lines between layout, mechanical and performance concerns begin to blur, which creates the need for PCB designers to take a more holistic view of the system.

In this presentation, Chris Carlson will discuss the unique and varied challenges that arise when doing multi board system designs. He will review the considerations relative to partitioning the PCB, connection management, connector libraries and planning the layout.  He will also discuss mechanical features, managing signals, thermal management, reliability and power and signal integrity.  Finally, Carlson will show how to ensure good mechanical fit by making the most of your 3D CAD functionality.

2nd Topic: Design and Manufacturing Developments to Lower Insertion Loss and Digital Pair SKEW – What a designer needs to about meeting 56Gb/s speed challenges

Speaker: Norm Berry, Director of Laminate and OEM Marketing at Insulectro

Topic: As frequency increases, differential pair SKEW and insertion loss become critical considerations for PCB design and manufacture.  Add the ever-increasing complexity of reliable designs, while balancing value / cost performance the manufacturing options become more challenging.  The designer needs to be aware of advancements in the base material manufacture and the options available to the fabricator.

Whether we are concerned with the demands of HDI designs with stacked, laser drilled micro VIAs or insertion loss on High Speed Digital backplanes, the base material composite, with low profile copper and a mechanically spread glass reinforcement, has a direct impact.  Backplanes operating at 56Gb/s require the integration all these factors and the newly developed manufacturing technologies.

Reserve a spot on your calendar on Thursday, June 28th from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” event.

Location:

Harvard Athletic Park   (The multi-purpose room is at the SOUTH end of the athletic fields)
14701 Harvard Ave.
Irvine, CA  92606

Click for Google Maps Directions

Agenda:      

Lunch served              11:30 – 11:50
Misc. Business            11:45 – 12:00
Presentations              12:00 – 1:20
Q & A discussion         1:20 –  1:25
Door prize raffle          1:25 –  1:30

Cost:  The cost to attend this Lunch ‘n Learn event will be $10.00 at the door.  We are pleased to have Altium sponsoring our event by helping us with the cost of the lunch, etc.

Please RSVP no later than noon on Wednesday, June 27th

There are TWO ways to RSVP:

Click to RSVP online: http://www.ocipcdc.org/meetings/meetings.html
Or email your RSVP to: scott.mccurdy@freedomcad.com

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